News & Press

News & Press

Nieuwsbericht 1

Introduction of VeCS




The package and circuit board industry need to make a step in order to keep up with the semiconductor market. 

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Nieuwsbericht 2

Layer detecting back drilling


Back drilling is becoming mainstream but so are the process problems which have a big influence on the product performance.  A large variation in the sub length will influence the product performance (Bit Error Rates on larger stub length signals will go up).   Layer detection can be don...

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First VeCS publication in trade magazine

First public article on VeCS


Please find the screen shot of the article below or click on this

Publication in "Printed Circuit Design & Fab" on March 15th, 2016.



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VeCS publication in IConnect007 - February 2017

Publication IConnect007 - February 2017

  Please click to open the publication in Iconnect007 february 2017. This will be the first in a line of articleson VeCS.

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