Introduction of VeCS

NextGIn Technology is introducing a new and disruptive technology in respect to the conventional semi-conductor package / circuit board industry.

The density of the vertical connections is limited and causing package and circuit board complxity to increase. NextGIn Technology is bringing a higher density technology using Vertical Conductive Structures. We can pack more vertical connections on a smaller space and at the same time increase routing channel density under grid array components.

We are working with a small group of selected OEM's in data-/tele-com and dataprocessing markets to design and test the technology.

We do not decrease line widths and isolations as that is causing transmission line speeds to go down. We work with wider traces and gaps to facilatate the objective of going to 100Gb/s speeds on copper in a few years.